Xinde Semiconductor

Xinde Semiconductor (Ticker: 7672 HK) provides semiconductor assembly and testing services. Its products include traditional and advanced semiconductor packaging, including wafer-level and 2.5D/3D formats. The company launched the Chiplet and Advanced Package integration Center to develop advanced packaging technologies. Established in September 2020, it had developed mass-production capability for traditional and advanced packaging.

Xinde Semiconductor reported revenue of RMB 509.10 million in 2023 and RMB 1.01 billion in 2025. For the four months ended April 30, 2026, revenue was RMB 359.70 million and its loss was RMB 161.90 million. As of the Latest Practicable Date, it had 232 patents in the PRC: 41 invention patents and 191 utility model patents.

Xinde Semiconductor expects to list on Hong Kong Stock Exchange on November 10, 2026. The proposed base offering comprises 106,562,500 shares at an indicative HKD 8.60–9.60 per share. At the indicative midpoint, the offering would represent gross proceeds of HKD 969.72 million, or approximately $123.61 million. Huatai Financial Holdings (Hong Kong) Limited is the sponsor. Underwriters include Huatai Financial Holdings (Hong Kong) Limited, First Shanghai Securities Limited and Huafu International Securities Limited.