Shanghai Sunmi Technology

Shanghai Sunmi Technology (Ticker: 6810 HK) provides Internet-connected solutions and smart commercial equipment for business operations. Its platform combines hardware, software and data insights through its proprietary SUNMI OS to support payments, order fulfillment and inventory management. The listing involves an issuance of H shares. IPO proceeds are planned primarily for research and development and product capacity enhancements, with additional funding intended for brand promotion, business development, working capital and strategic acquisitions.

The scheduled listing date on Hong Kong Stock Exchange was April 29, 2026. The proposed offering comprises 42,630,000 shares at an indicative price of HKD 24.86 per share. The base offering would represent HKD 1.06 billion, approximately $135.04 million in gross proceeds, excluding any unexercised over-allotment. The indicated IPO market capitalization is $965.30 million.

CITIC Securities, Deutsche Bank and ABCI Capital are joint sponsors and underwriters.