OmniVision Integrated Circuits Group

OmniVision Integrated Circuits Group (Ticker: 501 HK) designs CMOS image sensors, display solutions and analog integrated circuits. The company focuses on research, development and design, and works with third-party foundries to manufacture its products. Planned uses of IPO proceeds include research and development, expanding product capacity, brand promotion and strategic acquisitions. The company is headquartered in China.

The scheduled listing date on Hong Kong Stock Exchange was January 12, 2026. The proposed offering comprises 45,800,000 shares at an indicative price of HKD 104.80 per share. The base offering would represent HKD 4.80 billion, approximately $611.61 million in gross proceeds, excluding any unexercised over-allotment. The indicated IPO market capitalization is HKD 176.00 billion, approximately $22.43 billion.

CICC, UBS, GF Capital and Ping An of China Capital are sponsors.