Nexchip Semiconductor

Nexchip Semiconductor (Ticker: 2249 HK) operates a semiconductor foundry specializing in 12-inch wafer manufacturing and serving several semiconductor product categories. Its foundry serves display driver chips, CMOS image sensors, power management chips, logic chips and microcontrollers. Its process technologies range from 150 to 40 nanometers, and it had developed a 28-nanometer platform for logic chips as of the latest practicable date. The company serves applications including consumer electronics, automotive electronics, industrial control, artificial intelligence, the Internet of Things and memory. A 15% greenshoe option covers 32.42 million additional shares.

The scheduled listing date on Hong Kong Stock Exchange was July 10, 2026. The proposed offering comprises 216,170,000 shares at an indicative price range of HKD 30.00–32.30 per share. At the indicative range midpoint, the base offering would represent HKD 6.73 billion, approximately $858.03 million in gross proceeds, excluding any unexercised over-allotment.

BOCI Asia, CLSA, CMB International Capital, China International Capital Corp Hong Kong Securities and Futu Securities International are offering managers.