Montage Technology

Montage Technology (Ticker: 6809 HK) designs integrated circuits that connect memory and other components in cloud computing and artificial intelligence infrastructure. Its products include memory interface chips for DDR2 through DDR5 standards, as well as interconnect chips for PCIe and CXL systems. Planned uses of proceeds include research and development, expanding product capacity, brand promotion, business development and potential strategic acquisitions.

The scheduled listing date on Hong Kong Stock Exchange was February 9, 2026. The proposed offering comprises 65,890,000 shares at an indicative price of HKD 106.89 per share. The base offering would represent HKD 7.04 billion, approximately $897.44 million in gross proceeds, excluding any unexercised over-allotment.

CICC, Morgan Stanley and UBS are joint sponsors, while Goldman Sachs and CLSA are underwriters.