HOSIN Electronics

HOSIN Electronics (Ticker: 2681 HK) develops, manufactures and sells memory solutions. Its products include embedded storage, solid-state drives (SSDs), dynamic random-access memory (DRAM), mobile storage and memory integrated circuits. The company outsources much of its wafer processing, packaging and testing to third-party providers.

HOSIN Electronics expects to list on the Hong Kong Stock Exchange on November 12, 2026. The indicative offer price is HKD 72.29–82.90 per share, with 14,717,200 shares in the base offering. At the indicative midpoint, the offering represents estimated gross proceeds of HKD 1.14 billion, or approximately $145.56 million.

The company began supplying memory products for automotive applications in 2023 and entered the supply chains of Tier 1 suppliers to automakers. It has also begun mass production of memory products for enterprise applications. Underwriters include BOCI Asia, DBS Asia Capital and China Securities (International) Corporate Finance Company.