FourSemi
FourSemi designs power-amplifier audio chips and haptic drivers for consumer electronics and intelligent vehicles.
FourSemi (Ticker: 3625 HK) designs power-amplifier audio chips and haptic drivers that provide sound and tactile feedback in consumer electronics and intelligent vehicles. In 2023, the company introduced a power-amplifier audio chip certified to the AEC-Q100 automotive reliability standard. Founder Xu Xiaolin leads the company. Planned uses of IPO proceeds include research and development, production capacity, brand promotion, business development, working capital and strategic acquisitions.
The scheduled listing date on Hong Kong Stock Exchange was March 31, 2026. The proposed offering comprises 12,000,000 shares at an indicative price range of HKD 40.00–50.00 per share. At the indicative range midpoint, the base offering would represent HKD 540.00 million, approximately $68.81 million in gross proceeds, excluding any unexercised over-allotment. The indicated IPO market capitalization is $572.00–715.00 million.
Orient Capital and Guotai Junan Capital are sponsors. ABCI Capital, CCB International and Futu Securities are members of the underwriting syndicate.
Prepared with IPOX® AI assistance. Information may contain errors.
Prepared with IPOX® AI assistance. Information may contain errors.