Beijing ESWIN Computing Technology

Beijing ESWIN Computing Technology (Ticker: 1256 HK) develops semiconductor chips, chipsets, circuit boards and related software based on the RISC-V architecture, and provides packaging, testing and wafer-related services. Its products are intended for smart devices, automotive, robotics and industrial applications. A 15% greenshoe facility covers approximately 236 million shares.

The scheduled listing date on Hong Kong Stock Exchange was October 9, 2026. The proposed offering comprises 1,570,000,000 shares at an indicative price range of HKD 1.48–1.59 per share. At the indicative range midpoint, the base offering would represent HKD 2.41 billion, approximately $307.08 million in gross proceeds, excluding any unexercised over-allotment.

CLSA, CMB International Capital, China Securities International, GF Securities Hong Kong and Huatai Financial Holdings Hong Kong are among the offering managers.