SENASIC Electronics Technology Co., Ltd. (Ticker: 6675 HK) is a Chinese semiconductor company developing, manufacturing and selling sensor chips and related semiconductor products. The company focuses on wireless sensor SoCs, including automotive-grade wireless sensor SoCs, and also produces semiconductor integrated circuits, membrane integrated circuits, automotive integrated circuit chips and medical electronic chips.

SENASIC plans to list H shares on the Hong Kong Stock Exchange Main Board on June 17, 2026. According to published terms, the company plans to offer 53.41 million primary shares at HKD 18.36 per share, raising approximately HKD 981 million, or about USD 125 million. The IPO implies a market capitalization at offer of approximately USD 888 million.

According to the prospectus summary, SENASIC was the third-largest automotive wireless sensor SoC company globally and the largest in China by revenue in 2025. The company plans to use the IPO proceeds for R&D and product capacity, brand promotion and business development, working capital and strategic acquisitions. The offering includes a 15% greenshoe facility of approximately 8.01 million shares.