Senasic
Senasic develops, manufactures and sells sensor chips and other semiconductor products.
Senasic (Ticker: 6675 HK) develops, manufactures and sells sensor chips and other semiconductor products. Its products include wireless sensor system-on-chips, including automotive-grade versions, membrane integrated circuits, automotive integrated circuit chips and medical electronic chips. Planned uses of IPO proceeds include research and development, product capacity, brand promotion and business development, working capital, and strategic acquisitions.
The scheduled listing date on Hong Kong Stock Exchange was June 17, 2026. The proposed offering comprises 53,410,000 shares at an indicative price of HKD 18.36 per share. The base offering would represent HKD 980.61 million, approximately $124.95 million in gross proceeds, excluding any unexercised over-allotment. The indicated IPO market capitalization is $888.00 million.
Prepared with IPOX® AI assistance. Information may contain errors.
Prepared with IPOX® AI assistance. Information may contain errors.